Application Solution
Thermally conductive fillers and dispersions for pads, coatings, adhesives, encapsulants and heat dissipation materials.
Electronic Chemicals & Materials
CAS No.10043-11-5
SpecGrade and specification to be confirmed
DocsCOA / SDS / TDS
Boron nitride powder for thermally conductive, electrically insulating composites and electronic packaging materials.
Thermal Conductive Fillers & Dispersions
CAS No.To be confirmed
SpecThickness, lateral size and purity to be confirmed
DocsCOA / SDS / TDS
Boron nitride nanosheets for thermal and functional composite projects requiring morphology review.
Thermal Conductive Fillers & Dispersions
CAS No.To be confirmed
SpecSurface modification, particle size and purity to be confirmed
DocsCOA / SDS / TDS
Surface modified BN filler for improved compatibility in selected resin and coating systems.
Thermal Conductive Fillers & Dispersions
CAS No.To be confirmed
SpecParticle size distribution and purity to be confirmed
DocsCOA / SDS / TDS
Spherical alumina filler for thermal management materials requiring high loading and processability review.
Electronic Chemicals & Materials
CAS No.24304-00-5
SpecGrade and specification to be confirmed
DocsCOA / SDS / TDS
Aluminum nitride powder for thermal conductive composites, electronic packaging and thermal interface materials.
Thermal Conductive Fillers & Dispersions
CAS No.To be confirmed
SpecSolid content, particle size and solvent system to be confirmed
DocsCOA / SDS / TDS
Alumina dispersion for coating and filler applications where solvent system and particle size are key parameters.
Send the product name, CAS number, target specification, quantity and destination country for application-oriented sourcing review.
All products are supplied for research, development and industrial use only. Availability, shipping method and documentation may vary depending on destination country, product classification and regulatory requirements.