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For specialty chemicals and advanced materials, technical data and document availability may vary by supplier, grade, batch and destination country.

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Electronic Chemicals & Materials

Thermal Conductive Alumina

Thermal conductive alumina filler for electronic potting, encapsulation, coatings and thermal interface materials.

CAS No.

1344-28-1

Product Description

Thermal conductive alumina filler for electronic potting, encapsulation, coatings and thermal interface materials.

Specifications

Synonyms: Aluminum Oxide, Alumina Powder, Thermal Conductive Aluminum Oxide, Al2O3 Filler
Molecular Formula: Al2O3
Purity / Specification: Grade and specification to be confirmed
Appearance: White powder; particle size distribution, purity and surface treatment depend on grade.
Available Package: Small pack and commercial package options to be confirmed by particle size and grade.

Typical Applications

Thermal conductive silicone and epoxy composites

Potting and encapsulation materials

Electronic packaging

Thermal interface materials

Functional fillers for coatings and adhesives

Storage & Shipping

Store sealed in a dry place. Avoid moisture and contamination.

Availability, documentation and shipping method depend on grade, supplier, destination country and regulatory requirements.

Related Applications

Thermal Interface Materials Electronic Materials & Functional Coatings

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