Electronic Chemicals & Materials
Boron Nitride
CAS No.10043-11-5
SpecGrade and specification to be confirmed
DocsCOA / SDS / TDS
Boron nitride powder for thermally conductive, electrically insulating composites and electronic packaging materials.
Browse CAS-based specialty chemical and advanced material examples for R&D, pilot evaluation and industrial sourcing review.
7 materials found
All Products
Electronic Chemicals & Materials
CAS No.10043-11-5
SpecGrade and specification to be confirmed
DocsCOA / SDS / TDS
Boron nitride powder for thermally conductive, electrically insulating composites and electronic packaging materials.
Thermal Conductive Fillers & Dispersions
CAS No.To be confirmed
SpecThickness, lateral size and purity to be confirmed
DocsCOA / SDS / TDS
Boron nitride nanosheets for thermal and functional composite projects requiring morphology review.
Thermal Conductive Fillers & Dispersions
CAS No.To be confirmed
SpecSurface modification, particle size and purity to be confirmed
DocsCOA / SDS / TDS
Surface modified BN filler for improved compatibility in selected resin and coating systems.
Thermal Conductive Fillers & Dispersions
CAS No.To be confirmed
SpecParticle size distribution and purity to be confirmed
DocsCOA / SDS / TDS
Spherical alumina filler for thermal management materials requiring high loading and processability review.
Electronic Chemicals & Materials
CAS No.24304-00-5
SpecGrade and specification to be confirmed
DocsCOA / SDS / TDS
Aluminum nitride powder for thermal conductive composites, electronic packaging and thermal interface materials.
Thermal Conductive Fillers & Dispersions
CAS No.To be confirmed
SpecSolid content, particle size and solvent system to be confirmed
DocsCOA / SDS / TDS
Alumina dispersion for coating and filler applications where solvent system and particle size are key parameters.
Electronic Chemicals & Materials
CAS No.1344-28-1
SpecGrade and specification to be confirmed
DocsCOA / SDS / TDS
Thermal conductive alumina filler for electronic potting, encapsulation, coatings and thermal interface materials.